Available from
Scott Runnels Consulting


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Copyright 2002-2005 Scott Runnels Consulting


The video below shows a multi-level CMP+Deposition
simulation using Mesa. Notice how imperfections in the
results on Metal Level 1 influence the results on Metal
Level 2.


Give your staff the
competitive edge
of CMP insight and knowledge.

Using Mesa's physically-based model
of CMP, your staff can see and explore

  • Multi-level pattern density interactions
  • The physics of pad-wafer interaction
  • How and when materials are cleared
  • How 3D patterns affect polish performance
  • Effects of multiple slurries, different pad
    properties, process variations, and much more

Nothing can replace actually watching the
important CMP mechanisms at work. And
only Mesa provides this information in an
easy-to-use environment. Using Mesa yields
insight that is difficult to gain any other way.
Anyone involved in CMP can benefit from
using it.

Mesa has been successfully validated on

  • Oxide,
  • Copper, and
  • STI processes.

Mesa Version 5.0

Now available from
Scott Runnels Consulting.

Click here to find out more.

Thank you for your interest!