This video shows how the pad
interacts with the wafer to produce pattern-dependent polishing performance.
After you see this video, click here
to see another video showing the eroding profiles.
Give your staff the
of CMP insight and knowledge.
Using Mesa's physically-based
of CMP, your staff can see and explore
- The physics of pad-wafer
- How and when materials are
- How 3D patterns affect polish
- Effects of multiple slurries,
properties, process variations, and much more
Nothing can replace actually
important CMP mechanisms at work. And
only Mesa provides this information in an
easy-to-use environment. Using Mesa yields
insight that is difficult to gain any other way.
Anyone involved in CMP can benefit from
Mesa has been successfully
- Copper, and
- STI processes.
Mesa Version 4.4
Scott Runnels Consulting.
here to find out more.
Thank you for your interest!