The video below illustrates
how pattern density
influences the planarized film thickness, the
eventual dishing of copper, and the erosion of
oxide in the pattern.
After you see this video, click
here to see another
video showing the pad-wafer interface.
Give your staff the
of CMP insight and knowledge.
Using Mesa's physically-based
of CMP, your staff can see and explore
- The physics of pad-wafer
- How and when materials are
- How 3D patterns affect polish
- Effects of multiple slurries,
properties, process variations, and much more
Nothing can replace actually
important CMP mechanisms at work. And
only Mesa provides this information in an
easy-to-use environment. Using Mesa yields
insight that is difficult to gain any other way.
Anyone involved in CMP can benefit from
Mesa has been successfully
- Copper, and
- STI processes.
Mesa Version 4.4
Scott Runnels Consulting.
here to find out more.
Thank you for your interest!