Available from
Scott Runnels Consulting







srunnels@srconsult.com

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Copyright 2002-2005 Scott Runnels Consulting

The video below illustrates how pattern density
influences the planarized film thickness, the
eventual dishing of copper, and the erosion of
oxide in the pattern.

After you see this video, click here to see another
video showing the pad-wafer interface.

 

Give your staff the
competitive edge
of CMP insight and knowledge.

Using Mesa's physically-based model
of CMP, your staff can see and explore

  • The physics of pad-wafer interaction
  • How and when materials are cleared
  • How 3D patterns affect polish performance
  • Effects of multiple slurries, different pad
    properties, process variations, and much more

Nothing can replace actually watching the
important CMP mechanisms at work. And
only Mesa provides this information in an
easy-to-use environment. Using Mesa yields
insight that is difficult to gain any other way.
Anyone involved in CMP can benefit from
using it.

Mesa has been successfully validated on

  • Oxide,
  • Copper, and
  • STI processes.

Mesa Version 4.4

Available from
Scott Runnels Consulting.

Click here to find out more.

Thank you for your interest!